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1

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Wafer level warpage characterization for backside manufacturing processes of TSV interposers

Jiang, Feng, Wang, Qibin, Xue, Kai, Jing, Xiangmeng, Yu, Daquan, Shangguan, Dongkai

Year:

2014

Language:

english

File:

PDF, 2.58 MB

english, 2014

2

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Dry etching of fused silica glass in C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications

Lin, Laicun, Zhang, Mingchuan, Qiu, Delong, Jing, Xiangmeng, Jiang, Feng, Yu, Daquan

Year:

2014

Language:

english

File:

PDF, 772 KB

english, 2014

3

Deep dry etching of fused silica using C4F8/Ar inductively coupled plasmas

Lin, Laicun, Jing, Xiangmeng, Liu, Fengman, Yin, Wen, Yu, Daquan, Cao, Liqiang

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2017

Language:

english

File:

PDF, 1.92 MB

english, 2017

4

Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400°C for through silicon via application

Su, Meiying, Yu, Daquan, Liu, Yijun, Wan, Lixi, Song, Chongshen, Dai, Fengwei, Xue, Kai, Jing, Xiangmeng, Guidotti, Daniel

Journal:

Thin Solid Films

Year:

2014

Language:

english

File:

PDF, 478 KB

english, 2014

5

The effect of temporary bonding on post processing in TSV interposer manufacturing

Wang, Qibing, Yu, Daquan, Jiang, Feng, Liu, Haiyan, Jing, Xiangmeng

Journal:

Microsystem Technologies

Year:

2015

Language:

english

File:

PDF, 540 KB

english, 2015

6

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Numerical simulation and experimental verification of copper plating with different additives for through silicon vias

Song, Chongshen, Wu, Heng, Jing, Xiangmeng, Dai, Fengwei, Yu, Daquan, Wan, Lixi

Year:

2012

Language:

english

File:

PDF, 2.84 MB

english, 2012

7

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Dry etching of fused silica glass in C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications

Lin, Laicun, Zhang, Mingchuan, Qiu, Delong, Jing, Xiangmeng, Jiang, Feng, Yu, Daquan

Year:

2014

Language:

english

File:

PDF, 772 KB

english, 2014

8

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Study on undercutting of electroplated micro-bumps with different etchants

Dai, Fengwei, Yu, Daquan, Yin, Wen, Jing, Xiangmeng, Wan, Lixi

Year:

2012

Language:

english

File:

PDF, 1.71 MB

english, 2012

9

Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications

Lin, Laicun, Jing, Xiangmeng, Wang, Qidong, Jiang, Feng, Cao, Liqiang, Yu, Daquan

Journal:

Microsystem Technologies

Year:

2016

Language:

english

File:

PDF, 1.27 MB

english, 2016

10

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Modeling and simulation of silicon wafer backside grinding process

Li, Zhaoqiang, Jing, Xiangmeng, Jiang, Feng, Zhang, Wenqi

Year:

2014

Language:

english

File:

PDF, 662 KB

english, 2014

11

Ag–Cu–Zn alloy for brazing TiC cermet/steel

Lixia Zhang, Jicai Feng, Baoyou Zhang, Xiangmeng Jing

Journal:

Materials Letters

Year:

2005

Language:

english

File:

PDF, 632 KB

english, 2005

12

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Development of new TSV structure composing of intermetallic compounds

Daquan Yu,, Xiaoyang Liu,, Ran He,, Xiangmeng Jing,, Chongshen Song,, Fengwei Dai,, Yu Sun,, Lixi Wan,

Year:

2012

Language:

english

File:

PDF, 775 KB

english, 2012

13

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Heat dissipation design for a high density-high power chip package

Zhou, Jing, Cao, Liqiang, Guo, Xueping, Wang, Qidong, Guidotti, Daniel, Jing, Xiangmeng, Yu, Daquan, Wan, Lixi

Year:

2011

Language:

english

File:

PDF, 3.15 MB

english, 2011

14

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Study of equivalent thermal modeling and simulation of 2.5D/3D stacked dies module

Dai, Fengwei, Yu, Daquan, Zhou, Jing, Ma, He, Wu, Xiaomeng, Jing, Xiangmeng, Song, Chongshen, He, Hongwen

Year:

2013

Language:

english

File:

PDF, 413 KB

english, 2013

15

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Investigation of silicon stress around through silicon vias by high efficiency micro-Raman microscopy

Xiangmeng, Jing, Daquan, Yu, Hongwen, He, Fengwei, Dai, Meiying, Su

Year:

2013

Language:

english

File:

PDF, 429 KB

english, 2013

16

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Simulation analysis for interfacial failure of a poymer sealed MEMS device

Zhou, Jing, Wan, Lixi, Dai, Fengwei, Jing, Xiangmeng, Song, Chongshen, Guidotti, Daniel, Cao, Liqiang, Yu, Daquan

Year:

2012

Language:

english

File:

PDF, 1.46 MB

english, 2012

17

[IEEE 2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems - Zhuhai, China (2006.01.18-2006.01.21)] 2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems - A New Fabrication Method for 3D Multilayer Microstructure

Jing, Xiangmeng, Di Chen,, Zhang, Baozeng, Liu, Jingquan, Zhu, Jun

Year:

2006

Language:

english

File:

PDF, 3.88 MB

english, 2006

18

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Modeling and simulation of silicon wafer backside grinding process

Li, Zhaoqiang, Jing, Xiangmeng, Jiang, Feng, Zhang, Wenqi

Year:

2014

Language:

english

File:

PDF, 662 KB

english, 2014

19

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Non-destructive testing of through silicon vias by using X-ray microscopy

Jing, Xiangmeng, Yu, Daquan, Wang, Wei, Yu, Guoqing, Wan, Lixi

Year:

2012

Language:

english

File:

PDF, 1011 KB

english, 2012

20

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Temperature-dependant thermal stress analysis of through-silicon-vias during manufacturing process

Su, Meiying, Zhang, Xia, Wan, Lixi, Yu, Daquan, Jing, Xiangmeng, Fang, Zhidan, Hou, Fengze

Year:

2013

Language:

english

File:

PDF, 382 KB

english, 2013

21

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effect of thermal annealing on TSV Cu protrusion and local stress

Jing, Xiangmeng, He, Hongwen, Ji, Liang, Xu, Cheng, Xue, Kai, Su, Meiying, Song, Chongshen, Yu, Daquan, Cao, Liqiang, Zhang, Wenqi, Shangguan, Dongkai

Year:

2014

Language:

english

File:

PDF, 2.99 MB

english, 2014

22

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Non-destructive testing of through silicon vias by high-resolution X-ray/CT techniques

Xiangmeng Jing,, Daquan Yu,, Lixi Wan,

Year:

2012

Language:

english

File:

PDF, 904 KB

english, 2012

23

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Influence of thermal annealing on the deformation of Cu-filled TSV

He, Hongwen, Jing, Xiangmeng, Cao, Liqiang, Yu, Daquan, Xue, Kai, Zhang, Wenqi

Year:

2014

Language:

english

File:

PDF, 962 KB

english, 2014

24

Elastic MEMS probe card based on the PDMS substrate

Jing, Xiangmeng, Chen, Di, Huang, Chuang, Chen, Xiang, Miao, Jianmin, Liu, Jingquan, Zhu, Jun

Journal:

Journal of Micromechanics and Microengineering

Year:

2010

Language:

english

File:

PDF, 902 KB

english, 2010

25

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Copper pumping of through silicon vias in reliability test

Jing, Xiangmeng, Niu, Zhongcai, Hao, Hu, Zhang, Wenqi, Lee, Ui-hyoung

Year:

2015

Language:

english

File:

PDF, 605 KB

english, 2015

26

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Investigation of temporary bonding and release processes for TSV with copper pillar bumps

Jing, Xiangmeng, Jiang, Feng, Xu, Cheng, Xue, Kai, Dai, Fengwei, Li, Zhaoqiang, Zhang, Wenqi

Year:

2014

Language:

english

File:

PDF, 464 KB

english, 2014

27

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of annealing after copper plating on the pumping behavior of through silicon vias

Ji, Liang, Jing, Xiangmeng, Xue, Kai, Xu, Cheng, He, Hongwen, Zhang, Wenqi

Year:

2014

Language:

english

File:

PDF, 610 KB

english, 2014

28

[IEEE 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Singapore, Singapore (2015.6.1-2015.6.4)] 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Key process development on 300mm wafer for 2.5D/3D integration

Song, Chongshen, Xue, Kai, Jiang, Feng, Li, Hengfu, Feng, Guangjian, Jing, Xiangmeng, Zhang, W.

Year:

2015

File:

PDF, 1.66 MB

2015

29

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Investigation of temporary bonding and release processes for TSV with copper pillar bumps

Jing, Xiangmeng, Jiang, Feng, Xu, Cheng, Xue, Kai, Dai, Fengwei, Li, Zhaoqiang, Zhang, Wenqi

Year:

2014

Language:

english

File:

PDF, 464 KB

english, 2014

30

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Effect of annealing after copper plating on the pumping behavior of through silicon vias

Ji, Liang, Jing, Xiangmeng, Xue, Kai, Xu, Cheng, He, Hongwen, Zhang, Wenqi

Year:

2014

Language:

english

File:

PDF, 610 KB

english, 2014

31

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Via last TSV process for wafer level packaging

Jing, Xiangmeng, Dai, Fengwei, Zhang, Wenqi, Cao, Liqiang

Year:

2016

Language:

english

File:

PDF, 1.02 MB

english, 2016

32

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Low Cost Wafer Level Packaging of MEMS Devices by Vertical Via-Last Process

Jing, Xiangmeng, Dai, Fengwei, Zhang, Chunyan, Zhang, Wenqi, Cao, Liqiang

Year:

2016

Language:

english

File:

PDF, 522 KB

english, 2016

33

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Electrical simulation and fabrication of high Q spiral inductors on glass substrate using the glass reflow process

Chen, Hailiang, Jing, Xiangmeng, Shang, Jintang

Year:

2016

Language:

english

File:

PDF, 1.36 MB

english, 2016

34

Programmable and Multifunctional DNA-Based Materials for Biomedical Applications

Zhang, Yuezhou, Tu, Jing, Wang, Dongqing, Zhu, Haitao, Maity, Sajal Kumar, Qu, Xiangmeng, Bogaert, Bram, Pei, Hao, Zhang, Hongbo

Journal:

Advanced Materials

Year:

2018

Language:

english

File:

PDF, 11.77 MB

english, 2018

35

Biomedicine: Programmable and Multifunctional DNA-Based Materials for Biomedical Applications (Adv. Mater. 24/2018)

Zhang, Yuezhou, Tu, Jing, Wang, Dongqing, Zhu, Haitao, Maity, Sajal Kumar, Qu, Xiangmeng, Bogaert, Bram, Pei, Hao, Zhang, Hongbo

Journal:

Advanced Materials

Year:

2018

File:

PDF, 3.53 MB

2018

36

Real-time MR-guided brain biopsy using 1.0-T open MRI scanner

He, Xiangmeng, Liu, Ming, Liu, Chao, Fang, Jing, Xu, Yujun, Wang, Ligang, Xiang, Jianfeng, Sequeiros, Roberto Blanco, Li, Chengli

Journal:

European Radiology

Year:

2018

Language:

english

File:

PDF, 1.23 MB

english, 2018

37

TopicNet: a framework for measuring transcriptional regulatory network change

Lou, Shaoke, Li, Tianxiao, Kong, Xiangmeng, Zhang, Jing, Liu, Jason, Lee, Donghoon, Gerstein, Mark

Journal:

Year:

2020

File:

PDF, 781 KB

2020